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issue 01 2002
MicroMaterials & NanoMaterials
mechanical reliability simulation characterisation testing
ISSN 1619 - 2486
30,00 EUR(D)
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contents |
B. Michel
Preface
B. Michel, A. Schubert, T. Winkler
Micro Materials Center Berlin
D. Vogel, A. Gollhardt, B. Michel
Ongoing Research in the NanoMechanicsLab Berlin-Adlersdorf
A. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt,
B. Michel
Lead-free Flip-Chip Solder Interconnects - Materials Mechanics and Reliability Issues
J. Auersperg, R. Döring, B. Michel
Gains and Challenges of Parameterized Finite Element Modeling of Microelectronics Packages
M. Dost, E. Kieselstein, R. Erb
Displacement Analysis by Means of Grey Scale Correlation at Digitised Images and Image Sequence Evaluation for Micro- and Nanoscale Applications
O. Wittler, P. Sprafke, J. Auersperg, B. Michel, H. Reichl
Fracture Mechanical Analysis of Cracks in Polymer Encapsulated Metal Structures
M. Sonner, A. Gollhardt, D. Vogel, P. Sprafke, B. Michel,
H. Reichl
Life Time Prediction on Polymer Encapsulated Components
J .-P. Sommer
Thermo-Mechnical Reliability for High Frequency Applications
N. Rümmler, R. Schnitzer, B. Michel
Vibration Measurements of Micro Assemblies by Means of Laser Techniques
R. Dudek, H. Walter, B. Michel, P. Alpern, R. Schmidt, R. Tilgner
Studies on Parameters for Popcorn Cracking
short note:
V. Grosser, B. Michel, M. Schünemann, H. Reichl
From Modular MEMS to a Modular Microfactory - The Hybrid Microfactory?
About the Authors |
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issue 12 2010
MicroMaterials & NanoMaterials
nanotechnology
nanomaterials
nanoreliability
papers from Fraunhofer ENAS workshops in 2010
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Volume No.12 of „Micromaterials&Nanomaterials” (MM&NM) is a collection of papers from three different events.
The first part consists of papers and extended abstracts of a series of 6 seminars, organized at the newly founded
Fraunhofer Institute ENAS for Nanoelectronic Systems in Chemnitz/Saxony.
The second part of MM&NN comprises selected papers of the Joint Polish-German Workshop held in Chemnitz between Fraunhofer ENAS Chemnitz,
Fraunhofer IZM Berlin and the University of Wroclaw on recent research activities in reliability of micro-nano-integration.
The papers collected in part three of this volume all deal with a very special subject, the development of new tools in DIC technologies
(DIC - digital image correlation method).
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