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issue 02 2003
MicroMaterials & NanoMaterials
micro materials,
nano materials for automotives
volume of abstracts
ISSN 1619 - 2486
30,00 EUR(D)
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contents |
Research on micro- and nanotechnologies in Saxony
Trends in automotives - Challenges to research and technology
Current and future trends in nanotechnology
Reliable power electronics for automotive industry
Microsystem technology and their application
Advanced materials for high performance microprocessors
Requirements on high-temperature electronics for automotive industry
Ceramic microstructures and nanostructures for automotives
Materials- and technology aspects of Silicon micromechanics for application in the automotive industry
Polytronics for automotive applications
Mechatronics in automobile - the high temperature problem for the packaging
Interaction of thick wire bonding quality und vibration technique during the assembly of power modules
Substrates for high temperature applications
Packaging of high temperature components for use in automotives
Test and qualification of components for high temperature applications
Power Gold - an interconnection technology for high temperature electronics
Reliable high temperature electronics at competitive costs -
a contradiction?
Fluidic power modules for power electronics and stacked modules
LTCC-ceramics in the automobile
Automotive Silicon MEMS - Test and design for reliability
Evaluation of low temperature bonding interconnects for pressure sensors in automobile technology
New solutions with high temperature stable lead interconnects for electronic components
Temperature-stable metallisation and interconnect systems for sensor applications in automobiles
Nanomechanics for electronic components in the automobile
Challenges of advanced mechanical micro testing techniques
Mechatronics and micro system technology from the viewpoint of an automobile producer
Requirements for electronic technologies for future automobile systems
Mechatronics in automotives - challenges and solutions by the example of driving assistance systems
Modular high temperature mechatronics for gear box applications
Open architectures in in concert with with electronics
Design, assembly and packaging of mechatronic systems using von rapid prototyping processes
Concepts of multi-functional structures for electronic gas pedals
Micro mirror applications in the automobile
Analysis of fracture surface of thin Copper foils
nanoDAC - Method for reliability analysis on micro- and nanoscale
New developments in non-contact strain measurement using laser-speckle correlation techniques
LongLife - Optical measuring techniques for reliability evaluation of MEMS
Finite-Elemente based microdeformation measurement
Optical Crack Tracing - An automatised, simply applicable and precise measurement technique for fracture toughness of polymers
Structure formation in small lead volumina
Extension of application possibilities of AFMs
Micro system technology for the automotive industry (Trends)
Match-X - methodology and »box of bricks« for modular microsystems
Design, assembly and and qualification of modular microsystems in 3D-BGA technology
Sensors for advanced driving assistance systems
State-of-the-art and application capability of special kinetic sensors for automotives
Vibration analysis of microcomponents using laser vibrometry
Airbag fire elements based on Hafnium hydride
Durable, self-cleaning coatings in optical quality for for automotive applications
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issue 12 2010
MicroMaterials & NanoMaterials
nanotechnology
nanomaterials
nanoreliability
papers from Fraunhofer ENAS workshops in 2010
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Volume No.12 of „Micromaterials&Nanomaterials” (MM&NM) is a collection of papers from three different events.
The first part consists of papers and extended abstracts of a series of 6 seminars, organized at the newly founded
Fraunhofer Institute ENAS for Nanoelectronic Systems in Chemnitz/Saxony.
The second part of MM&NN comprises selected papers of the Joint Polish-German Workshop held in Chemnitz between Fraunhofer ENAS Chemnitz,
Fraunhofer IZM Berlin and the University of Wroclaw on recent research activities in reliability of micro-nano-integration.
The papers collected in part three of this volume all deal with a very special subject, the development of new tools in DIC technologies
(DIC - digital image correlation method).
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