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issue 03 2004
MicroMaterials & NanoMaterials
materials mechanics for system integration and packaging
dedicated to the memory of Andreas Schubert
ISSN 1619 - 2486
30,00 EUR(D)
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contents |
B. Michel, H. Reichl
A Severe Loss.
In Memoriam Dr.-Ing. Andreas Schubert.
H. Reichl, M.J. Wolf
System Integration Technology - Status and Outlook
R.V. Pucha, S.K. Sitaraman, S. Hegde, M. Damani,
C.P. Wong, J. Qu, Z. Zhang, P.M.Raj, R.R. Tummala
Materials and Mechanics Challenges in SOP-based Convergent Microsystems
A. Schubert, R. Dudek, E. Auerswald, A. Gollhardt, B. Michel, H. Reichl
Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation
G.Q. Zhang, X.J. Fan
Characterization and Modeling of Moisture Behavior of Electronic Packaging
J. Lau, W. Dauksher
Creep Constitutive Equations of Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu Lead-Free Solder Alloys
N. Meyendorf, Q. Zhan, B. Michel
High Resolution Nondestructive Evaluation Methods: Micro- and Nano-Materials Applications
R. Aschenbrenner
System Integration Through Packaging
J.H.L. Pang, B.S. Xiong, T.H. Low
Comprehensive Mechanics Characterization of Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder
R. Dudek, H. Walter, J. Zapf, B. Michel
Investigations on Low Cycle Fatigue of Electrodeposited Thin Copper and Nickel Films
Y. Fu, J. Liu
Electron Conduction Through Nano Particles in Electrically Conductive Adhesives
J. Auersperg, H. Badri Ghavifekr, E. Kieselstein, A. Schubert, B. Michel
Interface Toughness Evaluation for Flip Chip and CSP Assemblies Based on Fracture Mechanics Approaches
T. Hauck, T. Bohm, C. Trigas
Interface Fracture Mechanics for Molded Semiconductor Packages
T. Braun, K.-F. Becker, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl
Flip Chip Molding - High Reliable Flip Chip Encapsulation
A. Chandrasekaran, F.P. McCluskey
Effect of Green Encapsulant on High-Temperature Wirebond Reliability
J.-P. Clech
Comparative Analysis of Creep Data for Sn-Ag-Cu Solder Joints in Shear
S. Wiese, K.-J. Wolter
Microstructure and Creep of Eutectic SnAg and SnAgCu
D. Vogel, R. Dudek, J. Keller, B. Michel
Combining DIC Techniques and Finite Element Analysis for Reliability Assessment on Micro and Nano Scale
W. Scheel, K. Wittke, M. Nowottnick
A New Rapid Testing Method For the Evaluation of Thermo-mechanical Characteristics of Solder Joints
M. Schneider-Ramelow, K.- D. Lang, A. Ferber, P. Meier
Bond Reliability of New Quality Au and Cu Wires at High Temperature Load > 175 °C
E. Suhir
Coated Optical Fiber Interconnect Subjected to the Ends Offset and Axial Loading
K. Gottfried, Ch. Kaufmann, T. Gessner
Interconnect Systems in Automotive Sensors at Elevated Temperatures
B. Kämpfe, E. Auerswald
Investigation of Residual Stresses in Microsystems Using X-ray Diffraction
C. Landesberger, G. Klink, G. Schwinn, R. Aschenbrenner
New Dicing and Thinning Concept Improves Mechanical Reliability of Ultra Thin Silicon
J. Villain
Small Solder Volumes - Their Mechanical Behaviour and Their Special Microstructures
M. Werner, H.-J. Fecht
Review on Contacts to Diamond and SiC
M.J. Wolf, Se-Young Jang, O. Ehrmann, H. Reichl,
Kyung-Wook Paik
Characterization of Electroplated Leadfree Bumps
A. Schubert, R. Dudek, J. Kloeser, B. Michel, H. Reichl,
T. Hauck, K. Kaskoun
Experimental and Numerical Reliability Investigations of FCOB Assemblies with Process-induced Defects
B. Wunderle, J. Auersperg, V. Großer, E. Kaulfersch,
O. Wittler, B. Michel
Modular Parametric Finite Element Modelling for Reliability-Studies in Electronic and MEMS Packaging
J.-P. Sommer
Support of the Design Process for Advanced Electronic Components by Means of Finite Element Analysis
N. Ruemmler, R. Schnitzer, M. Dost
Characterization of Thermal-mechanical Sensor Properties by Laservibrometry
B. Michel
5 Years Fraunhofer Micro Materials Center Berlin -
The Competence Center for Reliability of Materials in Micro-
and Nanotechnologies |
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issue 12 2010
MicroMaterials & NanoMaterials
nanotechnology
nanomaterials
nanoreliability
papers from Fraunhofer ENAS workshops in 2010
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Volume No.12 of „Micromaterials&Nanomaterials” (MM&NM) is a collection of papers from three different events.
The first part consists of papers and extended abstracts of a series of 6 seminars, organized at the newly founded
Fraunhofer Institute ENAS for Nanoelectronic Systems in Chemnitz/Saxony.
The second part of MM&NN comprises selected papers of the Joint Polish-German Workshop held in Chemnitz between Fraunhofer ENAS Chemnitz,
Fraunhofer IZM Berlin and the University of Wroclaw on recent research activities in reliability of micro-nano-integration.
The papers collected in part three of this volume all deal with a very special subject, the development of new tools in DIC technologies
(DIC - digital image correlation method).
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