• Adaptronics and Reliability - A Combination for Breakthrough Technology in Motor Vehicle Design


• Lifetime Models for Assembly Techniques for Power Electronics


• Nanotechnology - Current Applications and Perspectives for the Automotive Industry


• Process-related and Technical Reliability of Highly Integrated Electronic Devices


• Materials in Automotive Engineering - Requirements and Trends


• Quality of Vehicle Electronics: New Test Concepts


• MEMS for Automotive Applications


• European Center for Microreliability and Nanoreliability


• Nanotechnology in Automotive Applications


• Analytics and Metrology in Semiconductor Industry: Future Challenges


• Reliability on the Micro- and Nano-Scale - Experiment and Simulation

Reliability of Micro and Nano Components

• Reliability Assessment of Joining Technology for Microelectronic Assemblies


• New Approaches for Qualification of Automotive Electronics Hardware


• Liquid Solders Joints for High Temperature Electronics


• Damage and Failure Analysis of Lead-free Solder Interconnects in Automotive Electronics


• Investigations of Automotive Components Regarding Vibrational Load


• Combination of nanoDAC and FEM for Reliability Analysis of Materials in the Micro-Nano-Transition Scale


• Qualification of New Electronic Packaging Technologies for Automotive Applications


• Modern Methods for the Reliability Management of Electronics Hardware


• Reliability of Solder Joints on Cold Gas Sprayed Layers


• Reliability Analyses of SnPb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several Test and Field Conditions


• Structure and Properties of Small Solder Joints A Critical View on the State of the Art


• Thermo-mechanical and Fracture Mechanical Characterization of Lead-free Solder Joints in Microelectronics


• Thermal Transient Characterization Methodology for Single-chip, Multichip and Stacked-chip Structures


• Substrates for Power Electronic Applications
  at Higher Temperatures


• Die Soldering Technologies for Power Electronics


• Multi-Chip-Module Techniques for Reliable Automotive Applications


• New Materials for Functionalized Applications as High Temperature Sensors in Automotive Field


• Accelerated Failure Test for High Temperature Applications of Power MOSFETs by Power Cycling


• Cosmic Radiation Effects as a Part of Microelectronic Systems Reliability Concern


• Microcontroller Design Under EMC Constraints


• Electromagnetic Reliability and Efficient System Design Towards the Development of Microelectronic Components


• Microelectronic Technologies for Mechatronic Systems in Cars

Micro and Nano Materials for Automotives

• Amorphous Electrically Conducting Materials for High Temperature Automotive Application


• Economic and Technical Perspectives of Nanomaterials


• Nanotechnology and its Application in Electronics and Micro System Technology


• Size Effects and Mechanical Properties of Lead-Free Solders Joints


• Environmental Aspects in Automotive Electronics Requirements, Implementation, Prospects


• Hyperelasticity and Fracture Mechanics for the Design of Micro-components made of Single Crystal Silicon


• Lead Innovation "NanoMobil"


• Novel Modeling Techniques of MEMS Sensors and Actuators for Electronic and System Design in Automotive Applications


• SiGe:C BiCMOS Technology for 77 - 81 GHz Automotive Radar Applications


• Static and Dynamic Analysis of the Micromechanical Properties of Thermal Spray Coatings for Engine Components


• Mechanical Reliability of Encapsulation of MEMS


• Design Support for a Real Pressure Sensor by Means of Finite Element Analysis


• High Performance Elastomers and Nanocompositesfor Automotive Tires


• UV-Curable Acrylate Nanocomposites for Outdoor Applications


• Toughening of Reactive Resins by Phase Separation and by Particles and Measuring Fracture Toughness by Optical Crack Tracing


• New Polymer Materials for Automotive Construction


• Characterization of Nanoscale Modified Polymers for Automotive Applications

Micro- and Nano Measuring Techniques

• Multi-Sensor Surface Inspection for the Automotive Industry


• Local Measurements of Strain using Laser Speckle Techniques


• A new Approach to Micro Deformation Analysis by Finite Element Based Digital Image Correlation


• Investigation of Intrinsic Stress in Diamond Films using Raman Spectroscopy and X-ray Diffraction


• Condition Monitoring of Automotive Electronic Systems with Life Cycle Units


• Micro and Nanomechanical Deformation Analysis at Materials Interfaces


• FIBDAC - A new Approach of Material Characterization for the Transition from Micro to Nano Scale


• Identification of Fitted Viscoelastic Material Parameters of Adhesives in Automotive Applications for Numerical Simulations using Genetic Algorithms

Applications of Microsystem Technologies in Automotives

• Micro-Mechatronics in Automotive Applications


• Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes


• Microsystems for Driver Assistance Systems. BMBF Initiative (German Ministry for Education and Research)


• New Inertial Sensor Cluster for Vehicle Dynamic Systems


• Efficient and Flexible High Aspect Ratio Micromachining for the Fabrication of low-g-Sensors


• Silicon InitiatorAirbag - Ignition Charges of New Technology


• Thermo-mechanical Reliability Analysis of Magneto-resistive Current Sensors


• Material Scientifical and Technological Reliability Aspects on Highly Stressed Automotive Components


• Thermal Management For 3D-Packages With Fluidical Cooling


• Thermal Analysis of Electronic Components and Systems


• Quantitative Analysis of the Adhesive Strength as Tool for the Reliability-focused Design of Micro-technical Structures


• Microstructures Generated by Ion Track Membranes Effect on Heat Transfer Surfaces a High Nucleate Boiling Rate


• Miniaturized Sensor Systems


• Digital Image Correlation - A Versatile Experimental Tool to Improve Reliability, Security and Lifetime


• Sensor Modules for Structural Health Monitoring and Reliability of Components


• Vibration Analyses for Function and Reliability Estimations of Automotive Sensors by Laser Vibrometry


• State-of-the-Art, Challenges and Novel Theoretical Models for IT Applications dealing with Security Issues for the Functionality of Complex Facility Management Systems


• Automotive IT-Security


• The Electronic Wedge Break (EWB)

Short note

• EUCEMAN - Formation of a European Center for Microreliability and Nanoreliability