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issue 06 2007
MicroMaterials & NanoMaterials
MicroNanoReliability 2007
volume of abstracts

ISSN 1619 - 2486
30,00 EUR(D)
contents
  • Research on micro- and nanotechnologies in Saxony

  • Micro- and nanomaterials

  • Reliability analysis and modelling

  • Modelling

  • Nano-indentation

  • Nanoanalysis

  • Reliability of micro-components and MEMS

  • Reliability concepts

  • Solder reliability modelling

  • Reliability applications

  • Special Workshop on aging and shelf life of MEMS

  • Optical metrology & deformation analysis

  • ESD and failure of electronic components

  • Characterization and testing

  • Reliability of MEMS

  • Solder Joint & Interconnect Reliability

  • Nanoscale strength and reliability

  • Reliability and lifetime estimation

  • Molecular modelling

  • Local stress analysis

  • Crack and fracture

  • Reliability monitoring & diagnostics

  • Interdisciplinary reliability aspects

  • Thermal modelling & characterization

  • Reliability and micro-structure

  • Adhesion

  • Reliabiliy - dynamic problems

  •    
    Kontakt
    issue 12 2010
    MicroMaterials & NanoMaterials
    nanotechnology
    nanomaterials
    nanoreliability
    papers from Fraunhofer ENAS workshops in 2010
    Volume No.12 of „Micromaterials&Nanomaterials” (MM&NM) is a collection of papers from three different events.
    The first part consists of papers and extended abstracts of a series of 6 seminars, organized at the newly founded Fraunhofer Institute ENAS for Nanoelectronic Systems in Chemnitz/Saxony.
    The second part of MM&NN comprises selected papers of the Joint Polish-German Workshop held in Chemnitz between Fraunhofer ENAS Chemnitz, Fraunhofer IZM Berlin and the University of Wroclaw on recent research activities in reliability of micro-nano-integration.
    The papers collected in part three of this volume all deal with a very special subject, the development of new tools in DIC technologies (DIC - digital image correlation method).
     
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